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Focus Microwaves Group



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Load Pull, Noise, Pulsed IV, Modeling


Microsanj


 

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The Microsanj Nanotherm-Series

Thermal Imaging Systems

 

NT110A
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NT210B/NT220B
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NT310B
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NT410A
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www.microsanj.com
 

 

HYBOND, Inc.


2730ebc1b89dbacc98ed4b769fa00672.jpg  HYBOND, Inc. 

designs, manufactures, and sells:

  • Thermosonic Ball and Wedge Wire Bonders
  • Peg Bonders (Single Point TAB Bonders)
  • Epoxy and Silver-Glass Die Bonders
  • Eutectic and Laser Diode Die Bonders
  • Pulsed Heat Fluxless/Eutectic Die Attach Station
  • DFS Universal Bonder Test Units
  • A variety of adjustable height heated work stages.
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